HP EX900 500GB M.2 2280 PCIe SSD
Model : HP EX900
Storage Capacity : 500GB
Type : Internal SSD
Interface : NVMe PCIe Gen3 x4
Read Speed :2100MB/s
Form Factor : M.2 2280
Write Speed : 1500MB/s
Warranty : 3 year
Additional information
| Brand | HP |
|---|---|
| Model | HP EX900 |
| Type | Internal SSD |
| Part No | 2YY44AA |
| Storage | 500GB |
| Flash Type | 3D TLC |
| Read Speed (Max.) | 2100MB/s |
| Write Speed (Max.) | 1500MB/s |
| Random Write IOPS | Up to 80,000 |
| Shock Resistance | 100G/6ms |
| TRIM Support | Yes |
| NCQ Support | Yes |
| ECC Support | Yes |
| MTBF | 2,000,000 hours |
| Form Factor (Inch) | M.2 2280 |
| Dimensions | 22 x 2.40 x 80mm |
| Weight | 5.4 gm |
| Warranty | 3 year |
| Others | 4KB Random Read: Up to 120,000 IOPS, 4KB Random Write: Up to 108,000 IOPS, Read Latency: 0.021 ms, Write Latency: 0.029 ms, MTBF: 2,000,000 hours, Max Vibration Resistance: 3.1 GRMS (2-500 Hz), Max Shock Resistance: 100G / 6 msec, Weight: 5.40gm, Features: High performance, Low power, Increased system responsiveness, High reliability, Small form-factor, Minimum weight, Enhanced ruggedness, High data Integrity and Security, Country of Origin – USA, Made in/ Assemble – China |
| Country Of Origin | USA |
| Made in/ Assemble | China |
Related products
| Brand | HP |
|---|---|
| Model | HP EX900 |
| Type | Internal SSD |
| Part No | 2YY44AA |
| Storage | 500GB |
| Flash Type | 3D TLC |
| Read Speed (Max.) | 2100MB/s |
| Write Speed (Max.) | 1500MB/s |
| Random Write IOPS | Up to 80,000 |
| Shock Resistance | 100G/6ms |
| TRIM Support | Yes |
| NCQ Support | Yes |
| ECC Support | Yes |
| MTBF | 2,000,000 hours |
| Form Factor (Inch) | M.2 2280 |
| Dimensions | 22 x 2.40 x 80mm |
| Weight | 5.4 gm |
| Warranty | 3 year |
| Others | 4KB Random Read: Up to 120,000 IOPS, 4KB Random Write: Up to 108,000 IOPS, Read Latency: 0.021 ms, Write Latency: 0.029 ms, MTBF: 2,000,000 hours, Max Vibration Resistance: 3.1 GRMS (2-500 Hz), Max Shock Resistance: 100G / 6 msec, Weight: 5.40gm, Features: High performance, Low power, Increased system responsiveness, High reliability, Small form-factor, Minimum weight, Enhanced ruggedness, High data Integrity and Security, Country of Origin – USA, Made in/ Assemble – China |
| Country Of Origin | USA |
| Made in/ Assemble | China |
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